Samsung's HBM5 and zHBM Numbers Are 2028 Targets, Not Silicon
At a Taipei summit Samsung laid out a 3D memory roadmap it calls CUBE. Every multiplier quoted is a goal measured against HBM4E, a part that is not shipping either.
23h ago
Artificial intelligence, professionally covered
At a Taipei summit Samsung laid out a 3D memory roadmap it calls CUBE. Every multiplier quoted is a goal measured against HBM4E, a part that is not shipping either.
23h ago
The two chipmakers paid a combined 11.21 trillion won for the first half, up 167% — a provisional August payment that is still only the second-highest first half on record.
2d ago

The eight-times bandwidth figure from Hot Chips is measured inside the package. Using it costs the host processor its cache, prefetch and out-of-order execution.
4d ago

This is a supply-chain report, not a launch — and the difference between stable mass production and the start of mass production is doing a lot of work in the coverage.
Aug 25, 2026

The layer at the bottom of the memory stack is becoming a logic chip, and it is getting hot faster than the stack above it.
Aug 24, 2026

The President ordered the Defence Ministry to clear Gwangju Air Base for a semiconductor complex. No operator, no capacity and no groundbreaking date have been named.
Aug 10, 2026
Six months from sub-60% to the threshold the industry calls a golden yield. The figure is an industry read, and the overtake everyone is quoting is a bank's projection.
Aug 10, 2026

At FMS 2026 in Santa Clara on 5 August, Samsung showed a 400-plus-layer V10 BV-NAND that is already in mass production, and two 3D memory architectures — zHBM and zNAND-O — that are not.
Aug 6, 2026

Operating profit rose more than eighteenfold to 89.5 trillion won, with the semiconductor division supplying 89.2 trillion of it. The Galaxy mobile unit posted the first operating loss in its history, squeezed by the component prices its own colleagues are charging.
Jul 30, 2026

A 20-year-old NAND line at Hwaseong, idle for years, is being rebuilt as a commodity DRAM end-fab — the clearest sign yet that the AI memory squeeze has reached the cheap chips.
Jul 27, 2026

Samsung, SK, Nvidia, Broadcom and Anthropic met South Korea's president in San Francisco and left with the largest single-day semiconductor supply package on record — none of it yet a signed contract.
Jul 25, 2026

At Unpacked in London, Samsung's new foldables become the launch vehicle for Google's newest on-device model, task automation across 40-plus apps, and a preview of Android XR glasses.
Jul 23, 2026

The Korean group would put in hundreds of millions of euros — possibly close to €1 billion — in a round that would roughly double the French lab's valuation in under a year.
Jul 22, 2026

Korea's memory giants are commercializing Compute Express Link modules — a layer between DRAM and storage — that they say can hold huge AI models close to GPUs at near-DRAM speed and lift inference throughput.
Jul 20, 2026
