Samsung and SK Hynix are pushing a new class of memory into commercial use, betting that AI inference is outgrowing the expensive high-bandwidth memory stacked beside GPUs. The technology, Compute Express Link (CXL), adds a tier between conventional DRAM and slower SSD storage — a way to give AI systems far more addressable memory without relying solely on scarce, costly HBM.
What CXL changes
Large models need to keep enormous parameter sets and context close to the processor. HBM is fast but limited in capacity and supply; system DRAM is cheaper but constrained by how much a server can physically hold. CXL lets memory be pooled and shared across devices over a high-speed interconnect, expanding the effective memory a GPU can reach — directly relevant to serving big models at scale.
The demos
SK Hynix showed a second-generation 256GB CMM-DDR5 module on CXL 3.2, and its researchers reported throughput gains of up to 35.7% on inference workloads. Samsung tested a 1TB CXL memory pool that reached about 92% of DRAM-level inference performance across eight GPUs — close enough to full-speed memory to be usable in production while adding far more capacity.
Timing and dependencies
Samsung is targeting year-end 2026 production of its CMM-D module, though it could slip to 2027 because CXL adoption depends on delayed Intel and AMD server platforms that support the standard. Yim So-jung, an analyst at Eugene Investment & Securities, said CXL "really takes off from 2026," with mainstream CXL-capable servers arriving by 2028.
A second front in the memory war
For the Korean giants, CXL is a way to sell more memory into AI systems beyond the HBM they already dominate — and to address the capacity ceiling that HBM alone cannot lift. It positions memory, not just GPUs, as a lever on how large and how cheaply AI models can be served.
