Aug 31, 2026Monday, August 31, 2026ENEnglishESEspañolPTPortuguêsRUРусскийITItalianoFRFrançaisARالعربيةZH中文KO한국어The Daily AI Briefing

Artificial intelligence, professionally covered

IndexOpenAI/Google/Anthropic/Meta/Nvidia/Microsoft/Apple/Mistral/EU AI Act

#HBM5

Samsung's HBM4 Base Die: 4nm Logic, Quadruple Power Density

The layer at the bottom of the memory stack is becoming a logic chip, and it is getting hot faster than the stack above it.

6d ago

A Samsung presentation slide headed High Bandwidth Memory, diagramming the core die and base die roles in an HBM stack with through-silicon vias to a computing die.