BOS Semiconductors

What BOS Semiconductors does

BOS Semiconductors specializes in designing system semiconductors for mobility innovation, primarily targeting autonomous driving SOC, HPC, and Gateway SOC in the automotive domain. They aim to provide total solutions including semiconductor design and related software. The company has secured funding from various investors and achieved design wins from global OEMs. Their team comprises members from top global companies with extensive experience in semiconductors, software, business, and legal fields. They are committed to delivering the highest standards of safety, comfort, and mobility experiences through their differentiated technology.

Products

• Eagle-NAn Automotive AI Accelerator designed for IVI and ADAS acceleration, offering flexible integration via PCIe or UCIe interfaces. It implements Tenstorrent's NPU cores, optimized for automotive applications, and provides industry-leading scalability in TOPS/W, TOPS/$, and software support. It supports today's and future AI models and extends to advanced mobility and diverse edge devices like robots. Mass production is planned for 2027.
• N1501An integrated circuit dedicated for automotive and physical AI applications, operating as a co-processor with a host system to provide additional processing capability for system-level data processing. Optimized for efficient integration into embedded systems using standard interfaces and development environments.
• N1301An integrated circuit designed for automotive and physical AI applications, functioning as a co-processor with a host system to provide additional processing capability for system-level data processing. Optimized for efficient integration into embedded systems using standard interfaces and development environments.
• Eagle-AA standalone one-chip ADAS SoC delivering 150 TOPS (Dense) performance for advanced driver assistance domain computing systems. It features a high-end CPU, GPU, NPU, ISP, DSP, and sensing interfaces for camera, LiDAR, and radar fusion sensing. It also supports UCIe and PCIe interfaces, making it compatible with the Eagle chiplet family. Mass production is planned for 2028.

Key capabilities

• 250 TOPS NPU (INT8) from Tenstorrent
• 2X of TOPS/$ compared to existing solutions
• 1.5X of TOPS/W
• Tensix NPU
• Supports TF32, FP16, BF16, FP8, MXFP, MXINT, INT8 data formats
• Programmable RISC-V cores
• Supports Structured Sparsity
• 4-way physical partition and Freedom from interference between partitions to support virtualization
• Arm Cortex-A53
• PCIe Gen5 interface
• UCIe for Chiplet architecture
• LPDDR5X, USB2.0
• ASIL-B, AEC-Q100 Grade2, Security engine
• Open Chiplet architecture
• Dedicated processing engine to support system-level data processing functions
• Standard interfaces such as PCIe, and LPDDR5X memory interface
• Security, safety, and peripheral functions for automotive applications
• Dedicated processing engine
• PCIe, USB, SD/eMMC, OSPI, Low Speed IO
• 190 INT8 TOPS (Dense) for N1301
• 150 TOPS (Dense) for Eagle-A
• High-end CPU, GPU, and NPU for Eagle-A
• ISP, DSP, and sensing interfaces for camera, LiDAR, and radar fusion sensing for Eagle-A

Use cases

• ADAS acceleration
• IVI acceleration
• Autonomous driving
• Advanced mobility
• Robotics
• Edge devices
• Automotive ADAS system
• Automotive computing systems
• System-level data processing
• Advanced driver assistance domain computing systems
• Camera, LiDAR, and radar fusion sensing

AI approach

BOS Semiconductors designs and develops AI accelerator chiplets and all-in-one SoCs for automotive and robotics applications, specifically for ADAS and IVI systems. They collaborate with Tenstorrent for NPU/AI IP, integrating Tenstorrent's NPU cores optimized for automotive applications into their products like Eagle-N.

Tech named: AI Accelerator, Chiplet SoC, NPU, AI IP, INT8, TF32, FP16, BF16, FP8, MXFP, MXINT, RISC-V cores, Structured Sparsity, Cortex-A53, PCIe Gen5, UCIe, LPDDR5X, USB2.0, ASIL-B, AEC-Q100 Grade2, Security engine, Open Chiplet architecture, CPU, GPU, ISP, DSP, sensing interfaces for camera, LiDAR, and radar fusion sensing, LLM, VLM

Industries served

• Automotive
• Robotics
• Semiconductor Manufacturing

What it says sets it apart

• Focus on mobility innovation with system semiconductors
• Proprietary chiplet SoC family (Eagle)
• Collaboration with Tenstorrent for NPU/AI IP
• Industry-leading scalability in TOPS/W, TOPS/$
• Comprehensive total solution including semiconductor design and software
• ISO 26262 Functional Safety Management Certification
• Experienced leadership team from top global companies (Apple, Tesla, Samsung, Baidu)
• Design wins from global OEMs

Funding rounds we track

From the AI funding tracker — rounds as reported by the linked publications.